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Printed Circuit Boards


ISO9001-2008 Certification

ISO/TS 16949-2009 Certification

UL Certification

ISO9001 and ISO/TS16949


High Quality Systems

Bare board PCB

Our manufacturing factory is well equipped to manufacture high quality printed circuit boards. We are very flexible to meet many different requirements in manufacturing PCB's. We do quick turn production ,as quick as one day for prototypes and small vlume orders, and also do mass production with blanket orders and monthly releases shipped in containers. The lead time can be any time frames from one day to one month even though most of our bare board PCB customers order using standard lead time of 10 business days. Our on-tine shippng rate is above 98% with 70% of the orders shipped earlier. The cutoff time is 9 am (pacific standard time) for quick turn orders and 8 pm for standard lead time orders, otherwise the order will not be considered placed until the following day.

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Our Capability on Bare Board PCB

Our Capabilities (please check PCB Glossary for reference). Please call us or email us if you have a special requirement not listed in the following table.

PCB (Printed Circuit Board)

Maximum Board Layers

Up to 20 layers

Maximum Board size

25" x 16"

Board thickness

Maximum board thickness (multilayer board):0.13"

Tolerance of standard board thickness (+/-10%):

Single sided or Double-sided: 0.02", 0.031", .039", .047", .062", .078", .094", .118",.125"

Base materials

FR-4, FR-406 (Tg 160 deg C), FR-408(Tg 175 deg C), G10, CEM3, Rogers, alumina ceramic

Copper weight

0.5 oz, 1 oz, 2 oz, 4 oz, 6 oz, 8 oz, 10 oz

Minimum conductor width

0.003" (0.075 mm)

Minimum conductor spacing

0.003" (0.075 mm)

Minimum finished hole size

0.006" (0.15mm).  (Please see our drill sizes in stock)

Silkscreen/Legend colors

white, yellow, black, pink, red

Solder Mask

LPI, Colors: Green, Black, Red, Blue, Purple, Yellow, Silver, Gold

Maximum hole aspect ratio 10:1
Plating Tin/Lead HAL, immersion gold (soft gold), electrolytic gold (hard gold), immersion tin, immersion silver, OSP
Gold finger Electrolytic gold on nickel: Max gold thickness 1.25 mm (50 micro-inches)


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